- CHIPSHIELD 2401
- Single-component, UV or heat cure, or a combination of both; high-purity glob-top encapsulant.
- CHIPSHIELD 2610
- UV and/or curable epoxy suitable for opto-electronic assembly. Cures rapidly when exposed to UV light wavelengths 320-390 nm to a tough chemical resistant material. Excellent adhesion to many substrates. Ultra low shrinkage upon cure. Low coefficient of thermal expansion.