Technical Resources

CHIPSHIELD

CHIPSHIELD 2401
Single-component, UV or heat cure, or a combination of both; high-purity glob-top encapsulant.
CHIPSHIELD 2610
UV and/or curable epoxy suitable for opto-electronic assembly. Cures rapidly when exposed to UV light wavelengths 320-390 nm to a tough chemical resistant material. Excellent adhesion to many substrates. Ultra low shrinkage upon cure. Low coefficient of thermal expansion.